SemiQ continues to expand its Gen3 QSiC MOSFET portfolio with 1200-V power modules offering high current density and low thermal resistance. The new seven-device lineup includes high-current S3 ...

This December, Sheryl Miles at Electronic Specifier takes a look at the top 5 power products released in December 2025.

From traditional fuses to eFuses, understanding the advantages, limitations, and use cases of each technology helps engineers ...

The Wide Bandgap Semiconductor Market is gaining strong momentum due to rising demand for energy-efficient power devices ...

The need to move beyond 12 V in automotive systems has been apparent for years, but now, finally, consensus seems to have ...

These days ready-to-use DC-DC converters are everywhere, with some of the cheaper ones even being safe to use without an ...

Learn more about whether nLIGHT, Inc. or Vishay Intertechnology, Inc. is a better investment based on AAII's A+ Investor grades, which compare both companies' key financial metrics.

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

Today, we continue our amd frame Project - over the coming months we are going to create a heavily customised build for AMD.

Abstract: Silicon carbide (SiC) power devices offer high switching speeds and power densities but are constrained by significant parasitic inductance and limited thermal dissipation capability.