Modern semiconductor manufacturing technology has advanced rapidly. Because of this, measurement using non-contact displacement and transparent coating thickness has become very critical. Applications ...
Tamar Technology's WaferScan provides high-resolution measurement of wafers made of any material, including glass, with submicron resolution for measurement of all surface shape parameters, including ...
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure MTI Instruments offers Proforma 300SA, a ...
In the last few years, semiconductor circuit features have shrunk to sub-100 nanometer (nm) dimensions, while the size of the thin silicon wafers that these circuits are constructed on has grown from ...
“LED manufacturers typically don't make their own sapphire wafers, so incoming quality control has become a requirement for LED chip makers as the industry continues to migrate from primarily 2″ ...
Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the yield ...
A new instrument under development at the US National Institute of Standards and Technology uses infrared laser light to precisely measure the thickness of 300 millimetre silicon wafers. In the last ...
The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...
LOWELL, Mass., June 12, 2014 /PRNewswire/ -- MicroSense, LLC, a leader in non-contact wafer metrology systems, today announced multiple shipments of its new, next-generation automated sapphire wafer ...
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